Features

As a leading producer of high-reliability passive components for use in military, aerospace, and medical electronic devices, AEM, Inc. has devised an aerospace-qualified tin/lead (Sn/Pb) conversion process designed to virtually eliminate the formation of tin whiskers on surface-mount component terminations (including types with external terminals). The AEM proprietary plating process delivers superior quality while eliminating the potential damage to sensitive electronic devices caused by conventional hot-solder dipping. AEM’s Sn/Pb conversion process is ideal for chip-scale passive components including capacitors, inductors, resistors, ferrite chip beads, fuses, resistor arrays, capacitor arrays, bead arrays, and many molded body passive and active surface mount component types.